Autodesk Fusion
The first integrated cloud CAD, CAM, CAE, and PCB platform for product development.
Revolutionizing Metal Additive Manufacturing through Electrochemical AI-Driven Precision.
Fabric8Labs is a deep-tech leader specializing in Electrochemical Additive Manufacturing (ECAM), a proprietary process that builds complex metal structures at the atomic level from an electrolyte solution. Unlike traditional laser-based powder bed fusion (DMLS), ECAM operates at room temperature, eliminating the thermal stresses and warping typically associated with metal 3D printing. By 2026, Fabric8Labs has integrated an advanced AI-driven spatial control layer that utilizes real-time computer vision and machine learning to monitor electrochemical deposition, ensuring micron-scale precision and structural integrity. This technology is strategically positioned for the semiconductor and telecommunications industries, providing ultra-high conductivity copper components for AI chip cooling (TSVs and micro-heatsinks). Their architecture leverages a software-defined manufacturing stack that allows for rapid scaling and iterative generative design, making it possible to produce mass-customized parts that were previously unmanufacturable. As a hardware-enabled AI solution, it bridges the gap between digital generative modeling and physical material realization, offering a sustainable, lower-energy alternative to conventional high-heat manufacturing methods.
Electrochemical deposition that avoids melting metal, preventing grain structure degradation and residual stress.
The first integrated cloud CAD, CAM, CAE, and PCB platform for product development.
AI-driven manufacturing optimization to produce high-performance, lightweight components in minutes.
The world's most advanced engineering design software for high-performance additive manufacturing.
Verified feedback from the global deployment network.
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Utilization of high-density electrode arrays to control deposition at the sub-100 micron level.
AI algorithms that design fractal-based cooling structures optimized specifically for ECAM constraints.
Ability to print IACS-standard high-purity copper without the additives required for laser absorption.
A live digital representation of the build that adjusts electrical parameters in real-time based on sensor feedback.
The printing units are modular and can be ganged together to scale production horizontally.
Process uses significantly less energy than laser-based systems and produces minimal waste.
Modern AI chips generate heat densities that standard cooling methods cannot manage.
Registry Updated:2/7/2026
Signal loss in high-frequency antennas due to surface roughness in traditional 3D printing.
The need for complex, bio-compatible metal parts at a micro-scale.